CVE-2023-33063 · netVigilance record NV23-0180

Qualcomm Multiple Chipsets Use-After-Free

past due

What to do

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

CISA deadline 2023-12-26 · passed 2 years 8 months ago · applies to US federal civilian agencies; used elsewhere as a reference SLA

What happened

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

Who is affected

Qualcomm Multiple Chipsets. Affected version ranges are listed in the vendor advisory and the NVD entry linked under Sources.

Weakness class: CWE-416.

Timeline

2023-12-05
Added to CISA KEVExploitation in the wild confirmed by CISA
2023-12-26
CISA remediation deadlinepassed 2 years 8 months ago

Sources

NVD entry for CVE-2023-33063 nvd.nist.gov/vuln/detail/CVE-2023-33063
CISA Known Exploited Vulnerabilities catalog www.cisa.gov/known-exploited-vulnerabilities-catalog
git.codelinaro.org git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a
git.codelinaro.org git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110
nvd.nist.gov nvd.nist.gov/vuln/detail/CVE-2023-33063